Amkor rises after breaking ground on its new semiconductor packaging campus in Arizona, while increasing investment in the project to $7 billion

Amkor Technology Inc. soared in after-hours trading on Monday after announcing that it was breaking ground on its semiconductor advanced packaging and test plant in Arizona, while also increasing the investment in the facility to a total of $7 billion in collaboration with the US government.

The expanded investment will add an “additional cleanroom space and a second greenfield packaging and test facility,” creating a campus with “over 750,000 square feet of cleanroom space and as many as 3,000 high-quality jobs,” per the company’s press release. The plant will focus on “advanced packaging and testing technologies and will complement TSMC’s front-end wafer fabrication for full end-to-end semiconductor manufacturing.”

Located close to TSMC’s factories in Arizona, the proximity should reduce the need to send US-produced chips back to Asia for the final stages of production.

Amkor’s mega-plant was already set to be one of the most ambitious US-sited semiconductor packaging operations before the expansion, but the latest announcement raises the total project investment by more than $5 billion, backed by the Trump administration’s CHIPS for America Program.

According to the company, the “construction of the first manufacturing facility on the campus is expected to be completed in mid-2027, with production beginning in early 2028.”

Amkor’s mega-plant has already locked in Apple and Nvidia as customers, with Apple’s chief operating officer, Sabih Khan, saying:

“Factories across the United States are producing 19 billion chips for Apple this year alone, and Amkor’s new facility will package and test the Apple silicon produced at TSMC Arizona just down the road. We’re proud to invest in Amkor through Apple’s American Manufacturing Program, which is a key part of our $600 billion commitment to create jobs and accelerate innovation right here in the U.S.”